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Samsung is said to be using chip-making technology favoured by its rival

Samsung reportedly uses MUF tech for its HBM chip production. However, Samsung has denied using MUF tech, calling it a rumor. Samsung is said to use chip-making tech its rival favoured The growing demand for high bandwidth memory (HBM) chips has surged due to the ongoing popularity of generative AI.…

AuthorBTW Editorial

Reading Time1 min

PublishedMarch 14, 2024

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Headline

Context

Samsung reportedly uses MUF tech for its HBM chip production. However, Samsung has denied using MUF tech, calling it a rumor. The growing demand for high bandwidth memory (HBM) chips has surged due to the ongoing popularity of generative AI. In this context, Samsung Electronics plans to utilize a chip-making technology favored by its rival, SK Hynix .

Evidence

Pending intelligence enrichment.

Analysis

According to analysts and industry experts, one reason for Samsung’s lagging behind is its persistence in using a chip-making technology called non-conductive film (NCF), which has caused some production problems. In contrast, Hynix has addressed NCF’s weaknesses by employing the mass reflow molded underfill (MR-MUF) method. “Samsung had to do something to ramp up its HBM production yields… adopting the MUF technique is a bit of a swallow-your-pride move for Samsung because it ended up following the technique first used by SK Hynix,” one source said. Also read: OpenAI’s Altman to meet chipmakers Samsung Samsung is reportedly achieving about 10-20% yield rates for its HBM3 production, lagging behind Hynix, whose chip production rate is secured at about 60-70%, according to analysts. However, Samsung has denied the estimated data and claimed it has secured a “stable yield rate.”