Trends
HaiLa Technologies partners with the UW to develop its backscatter technology
OUR TAKEHaiLa Technologies has entered into a license agreement with the University of Washington to develop and commercialise backscatter technology aimed at reducing the power consumption of wireless communications. It demonstrates the significance of academic-industry collaboration in driving inn…
Headline
OUR TAKEHaiLa Technologies has entered into a license agreement with the University of Washington to develop and commercialise backscatter technology aimed at reducing the power consumption of wireless communications. It demonstrates the significance of academic-industry…
Context
OUR TAKE HaiLa Technologies has entered into a license agreement with the University of Washington to develop and commercialise backscatter technology aimed at reducing the power consumption of wireless communications. It demonstrates the significance of academic-industry collaboration in driving innovation and sustainability in the development of smart devices. And also the aim of improving performance, battery life, and environmental impact in the IoT landscape. -Lia XU, BTW reporter HaiLa Technologies collaborates with the University of Washington to develop and commercialise backscatter technology to reduce power consumption in wireless communication. According to the agreement, HaiLa is granted rights to some strategic patents related to backscatter technology and will undertake the development and commercialisation of several multi-protocol , RF-capable system-on-chip (SoC) solutions.
Evidence
Pending intelligence enrichment.
Analysis
“Combining UW’s two decades of academic leadership in backscatter technology with HaiLa’s industry leadership in low-power wireless IoT chips will enable a new generation of standards-based smart devices with unprecedented performance and battery life compared to current Wi-Fi and Bluetooth devices,” said Matt Reynolds, the associate professor of electrical and computer engineering at the University of Washington. Derek Kuhn, President and CEO of HaiLa, stated, “The license agreement with the University of Washington complements HaiLa’s IP portfolio and further demonstrates our commitment to developing the most power-efficient radio technologies for IoT.” Also read: Exploring IoT projects: innovative applications and benefits Also read: IoT solutions: Transforming industries and enhancing lives
Key Points
- The collaboration aims to create multi-protocol, RF-capable System on Chip (SoC) solutions that offer connectivity with significantly reduced power consumption.
- The agreement grants HaiLa rights to patents related to backscatter technology, which is enabling the development of innovative IoT devices.
Actions
Pending intelligence enrichment.
