Nexperia China says it has begun small-batch 300 mm chip production

Evidence and uncertainty

The dated public record supports a company announcement on 9 March 2026, small-batch production, a 12-inch/300 mm wafer format and mature discrete products. Nexperia’s official material independently supports a 6/8-inch European front-end footprint and a historical division between European wafer fabrication and Asian assembly.

The record does not establish the 300 mm wafer supplier, monthly output, yield, qualification, customer acceptance or a complete front-end process controlled by Nexperia China. European headquarters declined to comment to Reuters, and company statements from the two sides conflict. WingSkySemi remains a reported possibility, not a proven supplier.