- Samsung Electronics Co-CEO, Kye-Hyun Kyung, announced at the annual shareholders’ meeting that the company anticipates revenue from its advanced chip packaging business to surpass $100 million this year.
- Samsung has developed HBM3E 12H, the largest capacity high-bandwidth memory chip, aiming to maintain its competitive edge in the high-end storage chip market amidst rising demand for artificial intelligence.
- Additionally, Samsung plans to release HBM4 in 2025 with customised designs and is focused on developing other memory products like CXL and PIM for AI applications.
Co-CEO Kye-Hyun Kyung of Samsung Electronics stated at the annual shareholders’ meeting held on Wednesday that it is expected the revenue of the company’s advanced chip packaging business will reach or exceed $100 million this year. Samsung Electronics established the advanced chip packaging business unit last year and anticipates real results from the company’s investments starting from the latter half of this year.
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Memory chip business aims to achieve a larger profit share
Kye-Hyun Kyung also mentioned that the goal for Samsung Electronics’ memory chip business this year is to achieve a larger profit share than its market share. According to data from the data provider TrendForce, Samsung Electronics held a market share of 45.5% in the DRAM chip market for tech devices in the fourth quarter of last year.
It’s reported that Samsung Electronics announced at the end of February that it has developed the industry’s largest capacity new high-bandwidth memory (HBM) chip to date. Samsung Electronics stated that the latest HBM3E 12H product stacks HBM3E DRAM chips up to 12 layers, making it the largest capacity HBM product so far. HBM3E 12H supports a maximum bandwidth of 1280GB/s around the clock, and the product capacity has also reached 36GB; compared to Samsung Electronics’ 8-layer stacked HBM3 8H, HBM3E 12H has significantly increased bandwidth and capacity by over 50%.
Samsung Electronics has begun providing samples of HBM3E 12H
Samsung Electronics has begun providing samples of HBM3E 12H to customers and plans to mass-produce the product in the first half of this year to ensure the company’s competitive advantage in the high-end storage chip sector amidst the rapidly increasing demand for artificial intelligence.
Kye-Hyun Kyung mentioned that the next-generation HBM product – HBM4 – may be released in 2025 with more customized designs. Samsung Electronics will leverage the advantage of integrating memory chip, chip foundry, and chip design businesses to meet customer demands.
In response to shareholder inquiries regarding recent setbacks Samsung Electronics encountered in the current HBM market compared to competitor SK Hynix, Kye-Hyun Kyung stated, “We have better prepared ourselves to prevent such occurrences in the future.”
Kye-Hyun Kyung also added, “Samsung Electronics looks forward to achieving tangible results soon with other memory products for artificial intelligence under development, such as Compute Express Link (CXL) and Processing in Memory (PIM).”
