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    Blue Tech Wave Media
    Home » MediaTek Launches Dimensity 6100
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    MediaTek Launches Dimensity 6100

    By Bal MarsiusJuly 14, 2023Updated:October 11, 2023No Comments4 Mins Read
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    Taiwanese mobile chipmaker MediaTek has unveiled its latest system on a chip, the

    Dimensity 6100+. The ground-breaking chip offers advanced features and enhanced 5G

    connectivity for the masses. With a focus on affordability, this new chip is poised to

    power future mainstream devices.

    The Dimensity 6100+ showcases an octa-core architecture based on the 6nm

    manufacturing process, featuring two powerful Cortex-A76 big cores and six efficient

    Cortex-A55 cores. In other words, it’s super fast.

    MediaTek highlights its “outstanding” user experience (UX) and graphics processing unit

    (GPU) performance, achieved through the use of the Arm Mali-G57 MC2 GPU.

    Hyperspeed and Super Crisp Images

    One of the chip’s notable features is its enhanced 5G modem, supporting the 3GPP

    Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation. MediaTek

    emphasises that this brings reliable sub-6GHz connectivity at a lower price point.

    Additionally, the chip incorporates MediaTek UltraSave 3.0+ technology, boasting a 20%

    reduction in 5G power consumption compared to competitors.

    The Dimensity 6100+ also supports 10-bit displays with one billion colours and refresh

    rates ranging from 90Hz to 120Hz, enhancing the visual experience for users. In terms

    of photography capabilities, it enables support for up to 108MP Non-ZSL cameras. It

    can handle up to 2K 30fps video capture, and AI-based colour enhancement and bokeh

    effects.

    Although the first brand to launch a device with the Dimensity 6100+ has not been

    announced, MediaTek confirms that it will be available in the third quarter of 2023.

    Unleashing the True Potential of Mainstream 5G

    Connectivity

    Featuring a 3GPP Release 16 standard modem, the Dimensity 6100+ incorporates the

    latest connectivity enhancements deployed by global cellular operators. It offers

    MediaTek 5G UltraSave 3.0+, a comprehensive suite of power-saving enhancements

    that results in 13-30% greater power efficiency compared to competitor alternatives in

    common 5G sub-6GHz connectivity scenarios.

    With a maximum of 140MHz cellular spectrum, the chip enables up to 3.3Gb/s 5G

    downlink speeds via 2CC carrier aggregation, delivering up to 40% faster downlink

    speeds in urban environments and up to 30% faster in suburbs compared to competitor

    alternatives. Carrier aggregation also facilitates seamless handover between two 5G

    connection areas, providing over 30% greater throughput layer coverage.

    MediaTek’s 5G modem incorporates situational intelligence enhancements that

    optimize downlink speeds when traveling on high-speed rail, subway systems, or

    underground vehicles, providing 20% more effective speeds than competitor

    alternatives.

    The Dimensity 6100+ supports dual low-band ENDC and 8-layer DL MIMO, meeting the

    requirements of major global cellular operators. Its support for 108MP camera sensors

    ensures highly detailed photos, while advanced noise reduction technologies guarantee

    clear and sharp selfies and low-light captures.

    The chip also enables hardware acceleration for dual cameras and depth perception,

    along with AI-camera enhancements such as AI-colour and single-camera bokeh

    effects.

    Billion-Color Display and HyperEngine 3.0 Lite Gaming

    Technologies

    The Dimensity 6100+ supports billion-color displays, enabling the rendering of real 10-

    bit images and videos for an enhanced user experience. Display speeds of up to 120Hz

    reduce visual fatigue and provide smooth interactions within applications.

    For gaming enthusiasts, MediaTek HyperEngine 3.0 Lite Gaming Technologies enhance

    gameplay by providing longer gameplay sessions, faster network responses, and more

    reliable connectivity. The chip’s 3rd generation 5G Call/Data Concurrency offers smooth

    performance in demanding game engines and intense gameplay scenarios. It also

    supports 5G/Wi-Fi concurrency with intelligent connection prediction.

    Exceptional Power-Efficiency

    Manufactured using TSMC N6 (6nm-class) chip production process, the Dimensity

    6100+ offers power efficiency, extending battery life even for demanding smartphone

    users. MediaTek’s engineering innovations have also resulted in a more compact

    platform, granting device manufacturers greater design freedom.

    MediaTek’s Dimensity 6100+ platform aims to meet the growing demand for 5G chips in

    mainstream mobile devices. As 5G networks continue to expand globally, and users

    transition from 4G to 5G, MediaTek is committed to providing cost-effective solutions

    that enhance performance, improve energy efficiency, and reduce overall costs.

    To read more about the technical details, visit MediaTek’s official page for Dimensity

    6100+.

    Electronics Product
    Bal Marsius

    Bal was BTW's copywriter specialising in tech and productivity tools. He has experience working in startups, mid-size tech companies, and non-profits.

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