Taiwanese mobile chipmaker MediaTek has unveiled its latest system on a chip, the
Dimensity 6100+. The ground-breaking chip offers advanced features and enhanced 5G
connectivity for the masses. With a focus on affordability, this new chip is poised to
power future mainstream devices.
The Dimensity 6100+ showcases an octa-core architecture based on the 6nm
manufacturing process, featuring two powerful Cortex-A76 big cores and six efficient
Cortex-A55 cores. In other words, it’s super fast.
MediaTek highlights its “outstanding” user experience (UX) and graphics processing unit
(GPU) performance, achieved through the use of the Arm Mali-G57 MC2 GPU.
Hyperspeed and Super Crisp Images
One of the chip’s notable features is its enhanced 5G modem, supporting the 3GPP
Release 16 standard with up to 140MHz 2CC 5G Carrier Aggregation. MediaTek
emphasises that this brings reliable sub-6GHz connectivity at a lower price point.
Additionally, the chip incorporates MediaTek UltraSave 3.0+ technology, boasting a 20%
reduction in 5G power consumption compared to competitors.
The Dimensity 6100+ also supports 10-bit displays with one billion colours and refresh
rates ranging from 90Hz to 120Hz, enhancing the visual experience for users. In terms
of photography capabilities, it enables support for up to 108MP Non-ZSL cameras. It
can handle up to 2K 30fps video capture, and AI-based colour enhancement and bokeh
effects.
Although the first brand to launch a device with the Dimensity 6100+ has not been
announced, MediaTek confirms that it will be available in the third quarter of 2023.
Unleashing the True Potential of Mainstream 5G
Connectivity
Featuring a 3GPP Release 16 standard modem, the Dimensity 6100+ incorporates the
latest connectivity enhancements deployed by global cellular operators. It offers
MediaTek 5G UltraSave 3.0+, a comprehensive suite of power-saving enhancements
that results in 13-30% greater power efficiency compared to competitor alternatives in
common 5G sub-6GHz connectivity scenarios.
With a maximum of 140MHz cellular spectrum, the chip enables up to 3.3Gb/s 5G
downlink speeds via 2CC carrier aggregation, delivering up to 40% faster downlink
speeds in urban environments and up to 30% faster in suburbs compared to competitor
alternatives. Carrier aggregation also facilitates seamless handover between two 5G
connection areas, providing over 30% greater throughput layer coverage.
MediaTek’s 5G modem incorporates situational intelligence enhancements that
optimize downlink speeds when traveling on high-speed rail, subway systems, or
underground vehicles, providing 20% more effective speeds than competitor
alternatives.
The Dimensity 6100+ supports dual low-band ENDC and 8-layer DL MIMO, meeting the
requirements of major global cellular operators. Its support for 108MP camera sensors
ensures highly detailed photos, while advanced noise reduction technologies guarantee
clear and sharp selfies and low-light captures.
The chip also enables hardware acceleration for dual cameras and depth perception,
along with AI-camera enhancements such as AI-colour and single-camera bokeh
effects.
Billion-Color Display and HyperEngine 3.0 Lite Gaming
Technologies
The Dimensity 6100+ supports billion-color displays, enabling the rendering of real 10-
bit images and videos for an enhanced user experience. Display speeds of up to 120Hz
reduce visual fatigue and provide smooth interactions within applications.
For gaming enthusiasts, MediaTek HyperEngine 3.0 Lite Gaming Technologies enhance
gameplay by providing longer gameplay sessions, faster network responses, and more
reliable connectivity. The chip’s 3rd generation 5G Call/Data Concurrency offers smooth
performance in demanding game engines and intense gameplay scenarios. It also
supports 5G/Wi-Fi concurrency with intelligent connection prediction.
Exceptional Power-Efficiency
Manufactured using TSMC N6 (6nm-class) chip production process, the Dimensity
6100+ offers power efficiency, extending battery life even for demanding smartphone
users. MediaTek’s engineering innovations have also resulted in a more compact
platform, granting device manufacturers greater design freedom.
MediaTek’s Dimensity 6100+ platform aims to meet the growing demand for 5G chips in
mainstream mobile devices. As 5G networks continue to expand globally, and users
transition from 4G to 5G, MediaTek is committed to providing cost-effective solutions
that enhance performance, improve energy efficiency, and reduce overall costs.
To read more about the technical details, visit MediaTek’s official page for Dimensity
6100+.
