Samsung Electronics reports progress on HBM4 memory chips as competition in the high-bandwidth memory market intensifies in 2026.
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China urges the Netherlands to correct its actions on Nexperia, saying Dutch intervention has disrupted the global semiconductor supply chain.
Chinese AI chip designer Biren completes a $717m Hong Kong listing, highlighting strong interest in domestic semiconductor innovation.
Baidu prepares a potential IPO for its AI chip arm Kunlunxin as China accelerates efforts to build domestic semiconductor capacity.
China’s LandSpace plans a $1 billion IPO to accelerate reusable rocket technology and expand its commercial space presence.
India’s broadband subscriber base crossed 1 billion in November 2025, reflecting rapid expansion of digital connectivity nationwide.
Heavy investment in AI chips signals ByteDance’s long-term commitment to scaling data-intensive and generative technologies.
Telefónica Tech sells its Latin America units to Hiberus, aiming to sharpen focus on core markets while ensuring service continuity.
Finland investigates damage to critical undersea telecom cable linking Helsinki and Tallinn after vessel seizure and crew arrests.
Nvidia is in advanced talks to acquire Israel’s AI21 Labs in a deal up to $3 billion to strengthen its AI software and talent base.
Netscout highlights AI-based threat intelligence and automation in 2025 cybersecurity but industry experts warn about risks of overreliance.
China requires chipmakers to use at least 50 % domestically made equipment for new capacity, reshaping semiconductor supply chains.