- Arteco debuts Fluordrop, a new line of direct-to-chip coolants tailored for data centres and AI infrastructure.
- The move marks its expansion from automotive thermal fluids into high-density compute environments.
What happened: Arteco debuts Fluordrop to meet rising liquid cooling demand in AI and HPC
Arteco, a Belgium-based thermal management specialist, has launched a new range of direct-to-chip coolants aimed at data centre and high-performance computing (HPC) markets. The product line, named Fluordrop, is designed to meet the thermal demands of dense compute environments, particularly AI and machine learning workloads.
The company, a joint venture between TotalEnergies and Chevron, has decades of experience in coolant technologies, primarily within the automotive industry. The new Fluordrop range represents Arteco’s first foray into data centre cooling, addressing rising demand for efficient thermal solutions as power densities increase. According to Capacity Media, Arteco’s expansion is part of a broader diversification strategy and responds to the industry’s shift from traditional air-based to liquid-based cooling methods.
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Why it is important
Arteco’s entry into the data centre space is a strategic move as the market pivots toward sustainable, high-efficiency cooling solutions. Direct-to-chip liquid cooling is emerging as a critical technology for supporting the extreme heat loads generated by AI accelerators and HPC clusters. According to research by Omdia, liquid cooling systems are expected to account for over 20% of thermal management investments by 2026.
Arteco’s automotive heritage positions it well to deliver high-performance, durable fluids with proven chemistry. The company’s R&D pedigree could drive innovation in coolant lifecycle management and compatibility with varied chip architectures. “Our goal is to support the sector’s move to more sustainable and efficient cooling,” said Wouter Castermans, Arteco’s managing director.
While competitors like Submer and LiquidStack focus on immersion cooling, Arteco’s direct-to-chip strategy offers a modular, retrofit-friendly alternative for existing data centres. Its entry could intensify competition and broaden choice in a rapidly consolidating market. Given the energy demands of AI, this development underscores how thermal management is becoming a linchpin of digital infrastructure strategy.
